发明名称 |
LIGHT-EMITTING DEVICE PACKAGE, MANUFACTURING METHOD THEREOF, AND VEHICLE LAMP AND BACKLIGHT UNIT INCLUDING SAME |
摘要 |
Disclosed are a light-emitting device package, a manufacturing method therefor, and a vehicle lamp and a backlight unit including the same. The light-emitting device package includes: a light-emitting chip having electrode pads positioned at a lower part thereof; a wavelength conversion unit for covering at least an upper surface and lateral surfaces of the light-emitting chip; and a reflective part which covers the lateral surfaces of the light-emitting chip. Accordingly, the light-emitting device package can be miniaturized and a separate substrate for forming a lens is not required. |
申请公布号 |
EP2999014(A4) |
申请公布日期 |
2016.11.23 |
申请号 |
EP20140797634 |
申请日期 |
2014.05.13 |
申请人 |
SEOUL SEMICONDUCTOR CO., LTD. |
发明人 |
JUNG, JUNG HWA;JUNG, SEOUNG HO;HWANG, SUNG KI |
分类号 |
H01L33/48;H01L33/50 |
主分类号 |
H01L33/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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