发明名称 レーザ加工方法及びレーザ加工プログラム作成装置
摘要 CAM (20) sets an evaluation region in an adjacent plane to a target plane; calculates the position of the extremity of the product profile in the axial direction within the evaluation region; sets a first line segment passing through the position of the extremity and extending orthogonally to the axis in the target plane; locates a processing area in the range surrounded by the first line segment, a second line segment, and the product profile, the second line segment extending in the axial direction from an end of the first line segment to the product profile; allocates a trajectory for laser beam cutting to form a notch or a hole in the processing area; and allocates a trajectory for laser beam cutting to cut the material along the product profile. This can normally perform even cut-off processing of the material.
申请公布号 JP6025652(B2) 申请公布日期 2016.11.16
申请号 JP20130102747 申请日期 2013.05.15
申请人 株式会社アマダホールディングス 发明人 大津 考亮
分类号 G05B19/4093;B23K26/00 主分类号 G05B19/4093
代理机构 代理人
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