| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive composition having sufficient adhesive strength even if a temperature at thermal compression bonding is lowered (for example, 160°C or less) and the time for thermal compression bonding is shortened (for example, 7 seconds or less).SOLUTION: An adhesive composition contains (A) acrylate compound, (B) polymerization initiator, and (C) filler. The (A) acrylate compound contains (A1) hydroxy group-containing acrylate compound. The (A1) hydroxy group-containing acrylate compound is blended in an amount of 45 mass% or more and 83 mass% or less, relative to the (A) acrylate compound 100 mass%. |
