| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for encapsulating a semiconductor exhibiting, while preserving the releasability of the encapsulating resin and a mold, a favorable storage stability, entailing a high adhesiveness of the encapsulating resin with a lead frame having a nickel-plated or silver-plated surface, and capable of improving moisture-absorbed solder characteristics, and a semiconductor device using the same.SOLUTION: In the provided epoxy resin composition for encapsulating a semiconductor including, as indispensable components, an epoxy resin, curatives, and an inorganic filler and used as a molding material for encapsulating a semiconductor mounted on a nickel-plated or silver-plated lead frame, a trimellitic anhydride ester mixture and a phenol resin are included as the curatives. |
