| 摘要 |
After forming a first trench extending through a top semiconductor layer and a buried insulator layer and into a handle substrate 10 of a semiconductor-on-insulator (SOI substrate 8, a dielectric waveguide material stack 22, 24, 26 including a lower dielectric cladding layer, a core layer and an upper dielectric cladding layer is formed within the first trench. Next, at least one lateral bipolar junction transistor (BJT), which can be a PNP BJT 30, an NPN BJT 40 or a pair of complementary PNP BJT 30 and NPN BJT 40, is formed in a remaining portion of the top semiconductor layer. After forming a second trench extending through the dielectric waveguide material stack to re-expose a portion of a bottom surface of the first trench, a laser diode is formed in the second trench. An optoelectronic device, for example a laser diode 60 may be formed on top of the compound semiconductor buffer layer 58 and edge coupled to the dielectric waveguide 22, 24, 26. |
