| 摘要 |
PROBLEM TO BE SOLVED: To provide an electroplating apparatus capable of forming normal plating at a high speed while reducing variation in the film thickness.SOLUTION: An electroplating apparatus 1 comprises: an annular mask 3 which is formed in an annular shape and has a plurality of openings 31; a liquid reserving part 4 arranged opposite to a substrate 2 to be treated in a state where the annular mask 3 is interposed therebetween, and filled with plating solution; and an anode 5 arranged in the liquid reserving part 4. The liquid reserving part 4 has an opening which faces at least part of overlapping part with the substrate 2 to be treated of the annular mask 3. The annular mask 3 is constituted so as to circulate along the annular shape thereof. The contact part with the substrate 2 to be treated of the annular mask 3 is constituted so as to move in synchronization with the substrate 2 to be treated while maintaining a state where the opening 31 overlaps a part 21 to be plated. |
