CURING COMPOSITION WITH IMPROVED HEAT RESISTANCE

摘要

The present invention provides a curable composition including: an organic polymer (A) which has on average 1.1 to 50 groups per one molecule thereof each represented by the general formula (1) and has one or more silicon-containing functional groups capable of cross-linking by forming siloxane bonds:
€ƒ€ƒ€ƒ€ƒ€ƒ€ƒ€ƒ€ƒ-NR 1 -C(=O)-€ƒ€ƒ€ƒ€ƒ€ƒ(1)
wherein R 1 is a hydrogen atom, or a substituted or unsubstituted monovalent organic group; and a metal carboxylate and/or a carboxylic acid (B), the curable composition giving a cured article excellent in curability and also excellent in heat resistance although a non-organotin catalyst is used.