| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing composition capable of high-speed polishing of silicon nitride.SOLUTION: A polishing composition is used in polishing a to-be-polished object containing a material having a plus zeta potential at pH 6 or lower and contains colloidal silica of a pH of 6 or lower which is fixed with sulfonic acid and has a minus zeta potential. |
