| 摘要 |
An housing of electronic device, includes a resin molded housing with an opening there through, a sheet metal positioned within the opening and a water proofing tape positioned on a side of the sheet metal, wherein a periphery of the sheet metal and an entirety of the water proofing tape are encased within the resin molded housing so as to seal the opening in a water tight manner, and, a front central portion of the sheet metal and a rear central portion of the sheet metal are exposed. |
