| 摘要 |
PROBLEM TO BE SOLVED: To provide a hollow package manufacturing method that can precisely position even a heat sink which is not integrated with a lead frame.SOLUTION: A method of manufacturing a hollow package that has a heat sink, a resin molding that supports the outer peripheral portion of the heat sink and constitutes a recess portion on which a semiconductor element is mounted, and a metal lead which is exposed to the inside of the recess portion at one end of the metal lead and to the side surface or lower surface of the resin molding at the other end of the metal lead, and has a thickness different from the heat sink, comprises a first step of inserting into a metal mold the heat sink having a positioning portion to which a positioning pin provided to the metal mold is fitted, and a lead frame having the metal lead are inserted, and a second step of filling thermosetting resin into the metal mold in which the heat sink and the lead frame are inserted and hardening the thermosetting resin. In the first step, the positioning pin is fitted to the positioning portion of the heat sink to position the heat sink. |
