发明名称 樹脂組成物、樹脂ワニス、プリプレグ、金属張積層板、及びプリント配線板
摘要 PROBLEM TO BE SOLVED: To provide a resin composition which has excellent dielectric properties of a polyarylene ether copolymer, provides a cured product excellent in heat resistance and dimensional stability, and also has excellent moldability.SOLUTION: The resin composition contains: a polyarylene ether copolymer having an intrinsic viscosity of 0.03 to 0.12 dl/g as measured in methylene chloride at 25°C and having on average 1.5 to 3 of phenolic hydroxyl groups per molecule at molecular terminals; and thermosetting compounds including a benzoxazinone compound. The total content of the polyarylene ether copolymer and the benzoxazinone compound is 70 to 100 pts.mass, with respect to 100 pts.mass in total, of the polyarylene ether copolymer and the thermosetting compounds.
申请公布号 JP6025129(B2) 申请公布日期 2016.11.16
申请号 JP20150026057 申请日期 2015.02.13
申请人 パナソニックIPマネジメント株式会社 发明人 北井 佑季;藤原 弘明;柏原 圭子;横山 大祐
分类号 C08L71/12;B32B15/08;C08J5/24;C08K3/00;C08K5/357 主分类号 C08L71/12
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