| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor pressure sensor achieving reduction in size thereof, detection with enhanced accuracy, and manufactured at low cost.SOLUTION: An absolute pressure sensor 1 as a semiconductor pressure sensor comprises: an absolute pressure sensor chip 10 as a pressure sensor chip having a front surface and a back surface; a package body 2 on which the absolute sensor chip 10 is mounted; and a die-bonding material 20 that is provided between the absolute pressure sensor chip 10 and the package body 2 on the back surface of the absolute pressure sensor chip 10, and fixes the absolute pressure sensor chip 10 to the package body 2. The absolute pressure sensor chip 10 includes a vacuum chamber 15 provided inside thereof and a diaphragm 13 contacting the vacuum chamber 15. As seen along a normal direction of the back surface of the absolute pressure sensor chip 10, an area of the die-bonding material 20 contacting the back surface of the absolute pressure sensor chip 10 is not located in an area of the back surface of the absolute pressure sensor chip 10 above which the diaphragm 13 overlaps, but is located only in an area around the area of the back surface of the absolute pressure sensor chip 10 above which the diaphragm 13 overlaps. |
