发明名称 Display With Vias to Access Driver Circuitry
摘要 A thin-film transistor layer, an organic light-emitting diode layer, and other layers may be used in forming an array of pixels on a substrate in a display. Vias may be formed through one or more layers of the display such as the substrate layer to form vertical signal paths. The vertical signal paths may convey signals between display driver circuitry underneath the display and the pixels. The vias may pass through a polymer layer and may contact pads formed within openings in the substrate. Vias may pass through a glass support layer. Metal traces may be formed in the thin-film transistor layer to create signal paths such as data lines and gate lines. Portions of the metal traces may form vias through a polymer layer such as a substrate layer or a polymer layer that has been formed on top of the substrate layer.
申请公布号 US2016329386(A1) 申请公布日期 2016.11.10
申请号 US201615091333 申请日期 2016.04.05
申请人 Apple Inc. 发明人 Sauers Jason C.;Guillou Jean-Pierre S.;Kardassakis Peter J.;Qin Shaowei;Tao Yi
分类号 H01L27/32;H01L51/56;H01L51/00;H01L51/52 主分类号 H01L27/32
代理机构 代理人
主权项 1. A display, comprising: a substrate; metal pads having opposing first and second surfaces; a polymer layer covering the substrate and the first surface of the metal pads, wherein vias in the polymer layer contact the first surface of metal pads; a thin-film transistor layer on the polymer layer, wherein metal traces in the thin-film transistor layer are coupled to the vias and provide signals to pixels formed using transistors in the thin-film transistor layer; and bonding material on the second surfaces of the metal pads.
地址 Cupertino CA US