SEMICONDUCTOR DEVICE PACKAGES INCLUDING A CONTROLLER ELEMENT AND RELATED METHODS

摘要

Semiconductor device packages include a stack of semiconductor memory devices positioned over an interposer substrate, a controller element, and a redistribution substrate positioned laterally adjacent to the controller element. At least a portion of the controller element is positioned directly between the stack and the interposer substrate. The controller element is operatively connected to the semiconductor memory devices of the stack through the redistribution substrate and the interposer substrate. Methods of manufacturing a semiconductor device package include positioning a redistribution substrate laterally adjacent to a controller element and attaching the redistribution substrate and the controller element to an interposer substrate. A stack of semiconductor memory devices is positioned over the controller element and the redistribution substrate. The controller element is operatively connected to the semiconductor memory devices of the stack through the redistribution substrate and the interposer substrate.

主权项

1. A semiconductor device package, comprising:
a stack of semiconductor memory devices positioned over an interposer substrate; a controller element positioned directly between the stack of semiconductor memory devices and the interposer substrate; and a redistribution substrate positioned laterally adjacent to the controller element, wherein the controller element is operatively connected to the semiconductor memory devices of the stack through the redistribution substrate and the interposer substrate.