发明名称 |
Reliable Device Assembly |
摘要 |
Microelectronic assemblies and methods for making the same are disclosed herein. In one embodiment, a method of forming a microelectronic assembly comprises assembling first and second components to have first major surfaces of the first and second components facing one another and spaced apart from one another by a predetermined spacing, the first component having first and second oppositely-facing major surfaces, a first thickness extending in a first direction between the first and second major surfaces, and a plurality of first metal connection elements at the first major surface, the second component having a plurality of second metal connection elements at the first major surface of the second component; and plating a plurality of metal connector regions each connecting and extending continuously between a respective first connection element and a corresponding second connection element opposite the respective first connection element in the first direction. |
申请公布号 |
US2016329290(A1) |
申请公布日期 |
2016.11.10 |
申请号 |
US201615212603 |
申请日期 |
2016.07.18 |
申请人 |
Invensas Corporation |
发明人 |
Haba Belgacem;Woychik Charles G.;Uzoh Cyprian Emeka;Newman Michael;Caskey Terrence |
分类号 |
H01L23/00 |
主分类号 |
H01L23/00 |
代理机构 |
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代理人 |
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主权项 |
1. A microelectronic assembly, comprising:
a first component having first and second oppositely-facing major surfaces, a first thickness extending in a first direction between the first and second major surfaces, and a plurality of first metal connection elements projecting in the first direction above the first major surface, each first metal connection element having a first plated metal region extending in the first direction above the first major surface; a second component having a first major surface and a plurality of second metal connection elements at the first major surface of the second component, the first major surfaces of the first and second components facing one another; and a plurality of plated metal connector regions each connecting and extending continuously in the first direction between a respective first surface of the plated metal region of a first metal connection element and a corresponding second surface of a second metal connection element opposite the respective first metal connection element. |
地址 |
San Jose CA US |