发明名称 Three-Dimensional (3D) Photonic Chip-to-Fiber Interposer
摘要 A method of fabricating an optical coupling device, comprising forming a waveguide mask layer on a substrate platform, wherein the waveguide mask layer comprises an array of openings comprising a first end and a second end opposite to the first end, immersing the substrate platform into a salt melt comprising ions to form an array of waveguides in the substrate platform through an ion diffusion process, and controlling a rate of immersion such that a diffusion depth of the ions varies as a function of a distance in a direction from the first end to the second end, wherein the array of waveguides extends in the direction from the first end to the second end.
申请公布号 US2016327749(A1) 申请公布日期 2016.11.10
申请号 US201514703229 申请日期 2015.05.04
申请人 Huawei Technologies Co., Ltd. 发明人 Jiang Jia
分类号 G02B6/30 主分类号 G02B6/30
代理机构 代理人
主权项
地址 Shenzhen CN