| 摘要 |
PROBLEM TO BE SOLVED: To provide a pressure sensor capable of preventing peeling of a metallic wiring pattern formed on a wiring substrate even if a repeated history of temperature load with large temperature difference occurs.SOLUTION: A pressure sensor includes a pressure detection unit which has a semiconductor type pressure detecting device built-in, and is equipped with a plurality of output terminal pins electrically connected to the semiconductor type pressure detecting device and a plurality of adjusting terminal pins; a cover to which the pressure detection unit is attached; and a relay substrate which is disposed in an inner space of the cover, and is equipped with wiring layers relaying the plurality of output terminal pins and a lead wire for external output. The inner space is filled with resin. The wiring layers formed on a surface of the relay substrate are disposed so as not to contact with the resin.SELECTED DRAWING: Figure 1 |
