| 发明名称 |
Semiconductor Package Configured for Connection to a Board |
| 摘要 |
A semiconductor package includes a plurality of contact areas having a specific contact area and a plurality of solder balls applied to the contact areas. Two or more specific solder balls are applied to the specific contact area, and a minimum distance between the two specific solder balls is set such that the two or more specific solder balls merge into one another when connecting them to a substrate in a reflow process. |
| 申请公布号 |
US2016329292(A1) |
申请公布日期 |
2016.11.10 |
| 申请号 |
US201615150515 |
申请日期 |
2016.05.10 |
| 申请人 |
Infineon Technologies AG |
发明人 |
Marbella Carlo |
| 分类号 |
H01L23/00 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor package, comprising:
a plurality of contact areas comprising a specific contact area; and a plurality of solder balls applied to the contact areas, wherein two or more specific solder balls are applied to the specific contact area and wherein a minimum distance between the two or more specific solder balls is set such that the two or more specific solder balls merge into one another when connecting them to a substrate in a reflow process. |
| 地址 |
Neubiberg DE |
