| 发明名称 |
ELECTRONIC DEVICE INCLUDING A METAL SUBSTRATE AND A SEMICONDUCTOR MODULE EMBEDDED IN A LAMINATE |
| 摘要 |
An electronic device having a substrate including a metal layer, an electrically insulating layer disposed above the substrate, a semiconductor module disposed above the electrically insulating layer and a lamination layer disposed above the electrically insulating layer. The lamination layer at least partially embeds the semiconductor module. |
| 申请公布号 |
US2016329260(A1) |
申请公布日期 |
2016.11.10 |
| 申请号 |
US201615097453 |
申请日期 |
2016.04.13 |
| 申请人 |
Infineon Technologies AG |
发明人 |
Dinkel Markus |
| 分类号 |
H01L23/31;H01L23/495;H01L21/56;H01L23/29 |
主分类号 |
H01L23/31 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An electronic device, comprising:
a substrate comprising a metal layer; an electrically insulating layer disposed above the substrate; a semiconductor module disposed above the electrically insulating layer; and a lamination layer disposed above the electrically insulating layer and at least partially embedding the semiconductor module. |
| 地址 |
Neubiberg DE |
