| 摘要 |
The invention provides an electronic control device having a high-grade heat sink that: does not require tight control at the time of manufacturing; does not restrict the range of electronic components that can be used; is structurally simple; can be produced at a higher production rate; and is cost-effective. In this device, when a circuit board 14 having an electronic component 13 thereon is placed in a non-metal (resin) housing having: a housing base 11 integrally comprising via a partition wall 11a a connector inserting section 18 used for electrical connection with an external mating connector (not illustrated); and a housing cover 12 attached to the housing base 11, part of the board 14 is inserted into an insertion hole provided in the partition wall 11a so that it is exposed inside the connector inserting section 16. A pair of elastic metal parts 15, a heat sink, is provided in the housing, connected to the circuit board 14 at particular positions on its top and bottom surfaces with the use of a connecting material 17 (solder or adhesive), and has an arch-shaped cross section as viewed from a lateral direction. The heat of the component 13 is transferred to the housing to dissipate it to the outside by the board 14 being supported from the top and bottom sides in the housing. |
