发明名称 半導体装置の製造方法、基板処理装置およびプログラム
摘要 A method of manufacturing a semiconductor device includes forming a thin film containing a predetermined element, oxygen, carbon, and nitrogen on a substrate by performing a cycle a predetermined number of times. The cycle includes supplying a predetermined element-containing gas to the substrate; supplying a carbon-containing gas and a plasma-excited inert gas to the substrate; supplying an oxidizing gas to the substrate; and supplying a nitriding gas to the substrate.
申请公布号 JP6022276(B2) 申请公布日期 2016.11.09
申请号 JP20120207602 申请日期 2012.09.20
申请人 株式会社日立国際電気 发明人 笹島 亮太;中村 吉延;奥田 和幸
分类号 H01L21/314;C23C16/36;C23C16/40;H01L21/31;H01L21/316;H01L21/318 主分类号 H01L21/314
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