发明名称 |
MICROETCHING AGENT FOR COPPER, SUPPLEMENTARY LIQUID FOR SAME, AND MANUFACTURING METHOD FOR CIRCUIT BOARD |
摘要 |
Disclosed is a microetching solution, a replenishment solution added to said microetching solution and a method for production of a wiring board using said microetching solution. The microetching solution for copper consists of an aqueous solution containing a cupric ion, an organic acid, a halide ion, a polymer and a nonionic surfactant. The polymer is a water-soluble polymer including a polyamine chain and/ or a cationic group and having a weight average molecular weight of 1000 or more. In the microetching solution of the present invention, a value of A/B is 2000 to 9000 and a value of A/D is 500 to 9000, where a concentration of the halide ion is A% by weight, a concentration of the polymer is B% by weight and a concentration of the nonionic surfactant is D% by weight. Using this microetching solution, adhesion to a resin or the like can be uniformly maintained even with a low etching amount. |
申请公布号 |
EP2878706(B1) |
申请公布日期 |
2016.11.09 |
申请号 |
EP20130804745 |
申请日期 |
2013.06.25 |
申请人 |
MEC COMPANY LTD. |
发明人 |
KURII, MASAYO;TAI, KIYOTO;NAKAMURA, MAMI;OGINO, YUKI |
分类号 |
C23F1/18;H01L21/308;H05K3/38 |
主分类号 |
C23F1/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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