发明名称 発光装置および発光装置の作製方法
摘要 An object is to provide a method for manufacturing a light-emitting device including a flexible substrate, in which separation is performed without separation at the interface between the light-emitting layer and the electrode. A spacer formed of a light absorbing material which absorbs laser light is formed over a partition of one of substrates, a coloring layer is formed over the other substrate, and the substrates are bonded to each other with the use of a bonding layer. The light-emitting layer and the electrode which are formed over the spacer are irradiated with laser light through the coloring layer, so that at least the bonding layer among the light-emitting layer, the electrode, the coloring layer, and the bonding layer is melted to form a fixed portion where the bonding layer and the spacer are bonded by welding.
申请公布号 JP6022809(B2) 申请公布日期 2016.11.09
申请号 JP20120109381 申请日期 2012.05.11
申请人 株式会社半導体エネルギー研究所 发明人 波多野 薫;千田 章裕;下村 明久;山崎 舜平
分类号 H05B33/10;H01L51/50;H05B33/02;H05B33/04;H05B33/12 主分类号 H05B33/10
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