发明名称 基板および半導体装置
摘要 PROBLEM TO BE SOLVED: To provide a substrate that allows preventing damage which, for example, a base material receives, while suppressing the number of dummy electrodes to be formed.SOLUTION: A substrate includes: a base material having a predetermined thickness; wiring provided on the base material; an electrode part 20 provided on one surface in the thickness direction of the base material and having a plurality of circuit electrodes 20a connected to the wiring; and a dummy region 21 provided on the same surface as the surface on which the electrode part is provided and having a plurality of dummy electrodes 21a that are not connected to the wiring. In at least a part of the dummy region, the plurality of dummy electrodes are disposed at a predetermined dummy pitch A1, and are disposed as a dummy electrode aggregate 22 in which the maximum value of the inter-dummy electrode distance is set to be less than or equal to a predetermined value.
申请公布号 JP6021383(B2) 申请公布日期 2016.11.09
申请号 JP20120081930 申请日期 2012.03.30
申请人 オリンパス株式会社 发明人 竹本 良章;高澤 直裕;齊藤 晴久;五味 祐一;只木 芳隆;菊地 広
分类号 H01L21/3205;H01L21/60;H01L21/768;H01L23/522;H01L25/065;H01L25/07;H01L25/18 主分类号 H01L21/3205
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