发明名称 レーザー加工装置
摘要 A laser processing apparatus including a laser beam branching mechanism provided between a laser oscillator and a focusing unit. The laser beam branching mechanism includes a spread angle adjusting unit for adjusting the spread angle of a laser beam and a branching unit for branching the laser beam into a plurality of laser beams. The branching unit includes a half-wave plate, a first polarization beam splitter for separating the laser beam into P polarized light and S polarized light, a first mirror for reflecting the P polarized light, a second mirror for reflecting the S polarized light, and a second polarization beam splitter for leading the P polarized light reflected by the first mirror and the S polarized light reflected by the second mirror to different optical paths extending in the same direction.
申请公布号 JP6022223(B2) 申请公布日期 2016.11.09
申请号 JP20120135039 申请日期 2012.06.14
申请人 株式会社ディスコ 发明人 能丸 圭司
分类号 B23K26/073;B23K26/064;B23K26/067;H01L21/301 主分类号 B23K26/073
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