| 摘要 |
PROBLEM TO BE SOLVED: To solve a problem that a conventional solder material does not necessarily have a sufficiently high thermal fatigue property in soldering of an Au electrode on which Au flash plating is carried out by flash treatment for providing thin plating in a short time.SOLUTION: A solder material utilized for soldering of an Au component electrode having Ni plate containing P includes 5.6-6.8 mass% of In, 0.3-4.0 mass% of Ag, 0-1.0 mass% of Bi, 0.035-0.7 mass% of Co, and the balance of only 87.5 mass% or more of Sn. |
