| 摘要 |
PROBLEM TO BE SOLVED: To provide a system for sticking a surface protective tape, capable of securely sticking an annular adhesive layer in association with an outer peripheral excess region of a wafer.SOLUTION: A system for sticking a surface protective tape 16 onto a wafer 11 having an outer peripheral excess region surrounding a device region where a plurality of devices are formed, includes a plurality of positioning protrusions 12, and a tape unit 8. The positioning protrusions 12 are each arranged at a predetermined distance from the wafer 11 with a rear side thereof held on a chuck table 10. The tape unit 8 includes the surface protective tape 16 and a plurality of positioning holes 22. The surface protective tape 16 includes: a substrate sheet 18 stuck on a release sheet 14 and having a diameter approximately identical to that of the wafer 11; and an annular adhesive layer 20 disposed on the outer periphery of the substrate sheet 18. The system sticks the surface protective tape 16 onto a surface of the wafer 11 by allowing the surface protective tape 16 to face the wafer and fitting the positioning protrusions 12 into the positioning holes 22 for positioning to associate the annular adhesive layer 20 with the outer peripheral excess region. |
