| 摘要 |
PROBLEM TO BE SOLVED: To provide tape that prevents chip scattering due to mill ends, that prevents adhesion of paste to chip rear surfaces so as to facilitate pickup of the chips, and that reduces damage to the chips during pickup, and to provide a method for processing a plate-like object using the tape.SOLUTION: Tape is to be stuck on a plate-like object that has: chip regions having chips in respective regions that are defined by a plurality of set intersecting division lines; and a peripheral surplus region that surrounds the chip regions. The tape includes: a substrate sheet that is made of a material having tack force on the plate-like object; and annular paste that is disposed on the substrate sheet corresponding to the peripheral surplus region of the plate-like object on which the tape is to be stuck. |
