发明名称 Light emitting device package
摘要 A semiconductor device, and more particularly a light emitting device package usable with a lighting apparatus is disclosed. The light emitting device package comprises a package body, a light emitting device located on the package body, the light emitting device emitting light having a first wavelength band, a transparent substrate located over the light emitting device with a distance therebetween, a wavelength conversion layer located on the transparent substrate, wherein the wavelength conversion layer absorbs and converts at least a part of the light having the first wavelength band into light having a second wavelength band, and a color calibration layer located on the wavelength conversion layer, the color calibration layer calibrating color of the wavelength conversion layer.
申请公布号 EP2736086(A3) 申请公布日期 2016.11.09
申请号 EP20130176342 申请日期 2013.07.12
申请人 LG ELECTRONICS, INC. 发明人 PARK DAEHYUN;HONG, GUNYONG;YOO, YOUNGGIL;KANG, DONGWON
分类号 H01L33/50 主分类号 H01L33/50
代理机构 代理人
主权项
地址