发明名称 レーザ加工機および孔開け加工方法
摘要 A laser processing machine employs a step of forming a pierced hole at a sheet material portion on an inner or outer side of a closed route when a processing to form a hole in the sheet material by cutting along a closed route is carried out. Following this pierced hole a step to perform a cutting process to cut to a predetermined position with a center of the laser beam traversing the closed route and a step of returning, in a condition in which laser irradiation is interrupted, a position of the laser processing head relative to the sheet material to assume a start position lying on the route during a step of cutting to the predetermined position and on the closed route are employed. Thereafter, a step of performing the cutting process from the start position along the closed route is carried out.
申请公布号 JP6020715(B2) 申请公布日期 2016.11.02
申请号 JP20150512437 申请日期 2014.03.31
申请人 村田機械株式会社 发明人 松本 圭太
分类号 B23K26/382;B23K26/00 主分类号 B23K26/382
代理机构 代理人
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