发明名称 研削装置
摘要 PROBLEM TO BE SOLVED: To adjust grinding load by detecting grinding load of each of two grinding means and controlling each grinding feed means.SOLUTION: In a grinding device 10, first grinding means 11a is disposed on a first surface 3a of a grinding base 3 via first grinding feed means 13a, and second grinding means 12a is disposed on a second surface 3b via second grinding feed means 14a. Accordingly, grinding load is applied to both the surface sides of the grinding base 3 with good balance, thereby enabling adjustment of the balance of the grinding load and prevention of generation of inclination in the grinding base 3 during grinding of a plate-like workpiece W.
申请公布号 JP6018459(B2) 申请公布日期 2016.11.02
申请号 JP20120179247 申请日期 2012.08.13
申请人 株式会社ディスコ 发明人 木村 謙
分类号 B24B41/047;B24B7/00;B24B49/16 主分类号 B24B41/047
代理机构 代理人
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