SURFACE WAVE DEVICE AND METHOD OF MANUFACTURING THE SAME

摘要

A surface acoustic wave device causing less wear of a dicing blade and causing less drop in a dicing speed is provided. The surface acoustic wave device is manufactured from a mother laminate with high yield and high precision. The surface acoustic wave device is manufactured by dicing a piezoelectric wafer 10. The surface acoustic wave device includes a piezoelectric substrate 10A resulting from dicing the piezoelectric wafer 10, IDT electrodes 1-3 and pad electrodes 4-7 formed on a top surface of the piezoelectric substrate 10A. A support layer 11 having an opening opened to the IDT electrodes 1-3 is formed. An outline edge 11b of the support layer 11 is inside an outline edge of the top surface of the piezoelectric substrate 10A. A cover 14 made of an insulating material is formed on the support layer 11 to close the opening of the support layer 11. In plan view, the outline edge of the cover 14 is aligned with the outline edge of the piezoelectric substrate 10A.