PROTECTIVE FILM FORMATION COMPOSITE SHEET, PROTECTIVE FILM-EQUIPPED CHIP, AND METHOD FOR FABRICATING PROTECTIVE FILM-EQUIPPED CHIP

摘要

There is provided a composite sheet for forming a protective film including: a pressure sensitive adhesive sheet having a pressure sensitive adhesive layer on a substrate; and a film for forming a protective film formed of a composition for forming a protective film on at least part of the pressure sensitive adhesive layer, wherein the composition for forming a protective film contains an inorganic filler (C) containing boron nitride particles (C1) and a content of the component (C) is 10 to 70 mass% relative to the total amount of the composition for forming a protective film. The composite sheet for forming a protective film exhibits the particular effects of making it possible to form a protective film with good heat dissipation properties and marking properties and to manufacture a highly reliable chip with protective film.