| 摘要 |
The purpose of the present invention is to provide a fluorescent light source device wherein high luminous efficiency and sufficiently high fluorescent intensity can be obtained in a fluorescent body. A fluorescent light source device of the present invention is configured by being provided with a fluorescent plate that emits fluorescence when receiving excitation light, and a heat dissipating substrate that dissipates heat generated in the fluorescent plate, said fluorescent plate and heat dissipating substrate being bonded to each other with a solder layer therebetween. The solder layer has a void fraction equal to or lower than 75 %, and a void longest diameter equal to or less than 0.4 mm. Furthermore, the solder layer preferably has a void fraction equal to or less than 50 %, and a void longest diameter equal to or less than 0.2 mm. |
