发明名称 化合物半導体装置及びその製造方法
摘要 PROBLEM TO BE SOLVED: To achieve a highly-reliable compound semiconductor device which successfully satisfies both of low on-state voltage and high off-state withstanding voltage with a simple composition and improves a device property without causing degradation in Schottky characteristics and decrease in yield of the device.SOLUTION: A compound semiconductor device comprises: a compound semiconductor lamination structure 2 including a GaN layer 2c, and an InAlN layer 2e which is formed above the GaN layer 2c and has a first region 2eand a second region 2e; and an anode electrode 5 formed on the InAlN layer 2e. The first region 2ehas an In composition rate lower than that of the second region 2e. The anode electrode 5 forms first Schottky junction SK1 with the first region 2eat an end and forms second Schottky junction SK2 with the second region 2eat a part other than the end.
申请公布号 JP6020043(B2) 申请公布日期 2016.11.02
申请号 JP20120238161 申请日期 2012.10.29
申请人 富士通株式会社 发明人 美濃浦 優一;吉川 俊英;岡本 直哉
分类号 H01L29/47;H01L21/329;H01L29/872 主分类号 H01L29/47
代理机构 代理人
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