| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayer wiring board, which is capable of reliably connecting a through conductor and a wiring conductor layer while preventing deformation and damage of resin insulating layers.SOLUTION: In a wiring board for electronic component inspection, a through hole 26 penetrating a wiring conductor layer 23 and resin insulating layers 21 and 22 is formed. In the through hole 26, a via conductor 27 connected to the wiring conductor layer 23 is formed by filling the through hole 26 with a conductive paste 51. The conductive paste 51 contains foam particles 52 which foam at a temperature equal to or higher than a curing temperature at which the resin insulating layers 21 and 22 cure. The plurality of resin insulating layers 21 and 22 having the via conductor 27 formed therein are arranged in a laminated manner and are heated to a temperature equal to or higher than the curing temperature, at which the foam particles 52 foam, while being pressurized in the lamination direction, whereby the plurality of resin insulating layers 21 and 22 are integrated with each other. |
