发明名称 化合物半導体装置及びその製造方法
摘要 A compound semiconductor device includes: a substrate; an electron transit layer formed over the substrate; an electron supply layer formed over the electron transit layer; and a buffer layer formed between the substrate and the electron transit layer and including AlxGa1-xN(0≦̸x≦̸1), wherein the x value represents a plurality of maximums and a plurality of minimums in the direction of the thickness of the buffer layer, and the variation of x in any area having a 1 nm thickness in the buffer layer is 0.5 or less.
申请公布号 JP6018360(B2) 申请公布日期 2016.11.02
申请号 JP20100269714 申请日期 2010.12.02
申请人 富士通株式会社 发明人 清水 さなえ;今西 健治;山田 敦史;宮島 豊生
分类号 H01L21/338;H01L29/778;H01L29/812 主分类号 H01L21/338
代理机构 代理人
主权项
地址