| 摘要 |
A method for manufacturing a mode converter including a substrate that is a single member and includes a first main surface, a second main surface opposite to the first main surface, and a micro hole which is formed in the first main surface and has a predetermined depth, grounding conductor layers that are formed on the first main surface and the second main surface, a plane circuit that is formed on the first main surface and is configured to transmit a high-frequency signal, and a pin that is formed so as to cover an inner surface of the micro hole and is electrically connected to the plane circuit, the method includes: irradiating the substrate with laser light and thereby forming a first modified portion to a desired depth from one main surface of the substrate; removing the first modified portion and thereby forming the micro hose; and filling the micro hole with a conductive material and thereby form the pin. |
