发明名称 METHOD FOR MANUFACTURING POWER-MODULE SUBSTRATE
摘要 A method for manufacturing a power module substrate includes a first lamination step of laminating a ceramic substrate (11) and a copper sheet (22) through an active metal material (26) and a filler metal (25) having a melting point of 660°C or lower on one surface side of the ceramic substrate (11); a second lamination step of laminating the ceramic substrate (11) and an aluminum sheet (23) through a bonding material (27) on the other surface side of the ceramic substrate (11); and a heating treatment step of heating the ceramic substrate (11), the copper sheet (22), and the aluminum sheet (23) laminated together, and the ceramic substrate (11) and the copper sheet (22), and the ceramic sheet (11) and the aluminum sheet (23) are bonded at the same time.
申请公布号 EP2978018(A4) 申请公布日期 2016.11.02
申请号 EP20140767678 申请日期 2014.03.17
申请人 MITSUBISHI MATERIALS CORPORATION 发明人 TERASAKI NOBUYUKI;NAGATOMO YOSHIYUKI
分类号 H01L23/12;B23K1/00;B23K1/19;B23K35/28;B23K35/30;B23K35/36;B23K103/00;B23K103/10;B23K103/12;B23K103/18;C04B37/02;C22C21/08;H01L21/48;H01L23/36;H01L23/373;H01L23/473 主分类号 H01L23/12
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