发明名称 Dual microstructure thermal barrier coating
摘要 A multi-layer thermal barrier coating (12) having a porous first layer of ceramic insulating material (20) and a second relatively dense layer of ceramic insulating material (22) having a plurality generally vertical gaps (26) formed therein. The porous conventional as-deposited APS microstructure of the first layer provides thermal and chemical protection for the substrate, while the gaps of the columnar-grained second layer provide thermal shock resistance for the coating. An air plasma spray process may be used to deposit both the first and the second layers of material, as well as any underlying bond coat layer. The gaps of the columnar-grained second layer do not extend into the first layer. The pores (28) of the first layer function as crack-arrestors for cracks initiating at the gaps of the second layer. <IMAGE>
申请公布号 EP1295964(B1) 申请公布日期 2016.11.02
申请号 EP20020078893 申请日期 2002.09.20
申请人 SIEMENS ENERGY, INC. 发明人 SUBRAMANIAN, RAMESH
分类号 C23C28/04;C23C4/02;C23C4/18;C23C28/00 主分类号 C23C28/04
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