| 摘要 |
PROBLEM TO BE SOLVED: To form pattern images without exposure defects caused by defocusing in all shots on a wafer by continuing exposure even when flatness of a substrate is partially deteriorated.SOLUTION: On the basis of a measurement result of flatness for a top face of a substrate held in a holder, a plurality of divided regions are determined for a specific shot (steps 106-118). In each of a plurality of partial pattern images resulting from dividing a pattern into at least two in accordance with the determined divided regions, scanning exposure is performed on each divided region, and a pattern image is formed in a shot subjected to divided exposure by connecting the plurality of partial pattern images. Regarding the shot, satisfactory exposure is performed with a small defocusing amount for each of the plurality of partial pattern images in comparison with the case where an image of an entire pattern is formed by one time of exposure. Regarding a shot of which the flatness is equal to or higher than a predetermined level, a pattern image is formed by normal scanning exposure. |
