发明名称 COIL TOPOLOGIES FOR INDUCTIVE POWER TRANSFER
摘要 This disclosure provides systems, methods and apparatus including a magnetic flux device configured to transmit or receive magnetic flux. In certain configurations, the magnetic flux device can include a first coil with a first layer and second layer, a second coil with a third layer and fourth layer, and a magnetically permeable material with the first coil extending over a first edge of the magnetically permeable material and the second coil extending over a second edge of the magnetically permeable material. In certain other configurations, the magnetic flux device can include a first conductive structure including a first coil and a second coil enclosing a first area and a second area, respectively. The magnetic flux device can further include a second conductive structure with at least a first planar portion of the first conductive structure being substantially coplanar with a second planar portion of the second conductive structure.
申请公布号 EP3084914(A1) 申请公布日期 2016.10.26
申请号 EP20140821999 申请日期 2014.12.12
申请人 QUALCOMM INCORPORATED 发明人 WIDMER, HANSPETER;KEELING, NICHOLAS ATHOL;BEAVER, JONATHAN
分类号 H02J5/00;B60L11/18;H01F38/14;H02J7/02 主分类号 H02J5/00
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