发明名称 |
SUBSTRATE COMPRISING IMPROVED VIA PAD PLACEMENT IN BUMP AREA |
摘要 |
Some novel features pertain to an integrated device that includes a substrate, a first via, and a first bump pad. The first via traverses the substrate. The first via has a first via dimension. The first bump pad is on a surface of the substrate. The first bump pad is coupled to the first via. The first bump pad has a first pad dimension that is equal or less then the first via dimension. In some implementations, the integrated device includes a second via and a second bump pad. The second via traverses the substrate. The second via has a second via dimension. The second bump pad is on the surface of the substrate. The second bump pad is coupled to the second via. The second bump pad has a second pad dimension that is equal or less then the second via dimension. |
申请公布号 |
EP3084826(A1) |
申请公布日期 |
2016.10.26 |
申请号 |
EP20140825040 |
申请日期 |
2014.12.17 |
申请人 |
QUALCOMM INCORPORATED |
发明人 |
FU, JIE;ALDRETE, MANUEL;SHAH, MILIND PRAVIN |
分类号 |
H01L23/498 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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