发明名称 |
HEATING DEVICE FOR HOT STAMPING |
摘要 |
A heating device for hot stamping (1) is configured to heat a plated metallic material (9) while conveying the plated metallic material. The heating device for hot stamping comprises: a first heating tank (3A) provided in a conveyance path for the plated metallic material; and a second heating tank (3B) provided downstream of the first heating tank in the conveyance path (2). A heating amount provided by the second heating tank is configured such that a temperature of the plated metallic material becomes equal to or higher than Ac3 point and less than a boiling point of a plating of the plated metallic material, and a heating amount provided by the first heating tank is configured to be larger than the heating amount provide by the second heating tank. |
申请公布号 |
EP2944393(A4) |
申请公布日期 |
2016.10.26 |
申请号 |
EP20130871152 |
申请日期 |
2013.12.26 |
申请人 |
FUTABA INDUSTRIAL CO., LTD. |
发明人 |
KAMIYA, YOSHIHIRO |
分类号 |
B21D24/00;B21D22/02;B21D22/20;C21D1/18;C21D1/673;C21D9/00;C21D9/46;F27B9/24;F27B9/36 |
主分类号 |
B21D24/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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