发明名称 |
SYSTEMS, METHODS, AND APPARATUSES FOR HYBRID MEMORY |
摘要 |
Embodiments of the invention are generally directed to systems, methods, and apparatuses for hybrid memory. In one embodiment, a hybrid memory may include a package substrate. The hybrid memory may also include a hybrid memory buffer chip attached to the first side of the package substrate. High speed input/output (HSIO) logic supporting a HSIO interface with a processor. The hybrid memory also includes packet processing logic to support a packet processing protocol on the HSIO interface. Additionally, the hybrid memory also has one or more memory tiles that are vertically stacked on the hybrid memory buffer. |
申请公布号 |
EP2519948(B1) |
申请公布日期 |
2016.10.26 |
申请号 |
EP20100841482 |
申请日期 |
2010.12.10 |
申请人 |
INTEL CORPORATION |
发明人 |
DUNNING, DAVE;CASPER, BRYAN;MOONEY, RANDY;MANSURI, MOZHGAN;JAUSSI, JAMES E. |
分类号 |
G11C5/02 |
主分类号 |
G11C5/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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