发明名称 基板処理装置および基板処理方法
摘要 When a substrate W is processed, a ring-shaped protective wall is located above the substrate held by the substrate holding unit and extends in a circumferential direction of the substrate. A radial position of an external periphery of a lower end of the protective wall is the same as a radial position of an internal periphery of a peripheral portion of an upper surface of the substrate held by a substrate holding unit, or is located at a radial outside. A first gap is formed between the protective wall and an upper surface of the substrate, a second gap is formed between the protective wall and a wall that defines the upper opening of the cup, and when the interior space of the cup is exhausted, a gas present above the substrate is introduced through the first gap and the second gap into the interior space of the cup.
申请公布号 JP6017262(B2) 申请公布日期 2016.10.26
申请号 JP20120235974 申请日期 2012.10.25
申请人 東京エレクトロン株式会社 发明人 東 島 治 郎;天 野 嘉 文;岡 本 英一郎;伊 藤 優 樹
分类号 H01L21/304 主分类号 H01L21/304
代理机构 代理人
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