发明名称 反応管、基板処理装置、及び半導体装置の製造方法
摘要 Provided are a reaction tube, a substrate processing apparatus, and a method of manufacturing a semiconductor device capable of suppressing a non-uniform distribution of a gas in a top region to improve the flow of the gas and film uniformity within and between substrate surfaces. The reaction tube has a cylindrical shape, accommodates a plurality of substrates stacked therein, and includes a cylindrical portion and a ceiling portion covering an upper end portion of the cylindrical portion, the ceiling portion having a substantially flat top inner surface. A thickness of a sidewall of the ceiling portion is greater than that of a sidewall of the cylindrical portion.
申请公布号 JP6016542(B2) 申请公布日期 2016.10.26
申请号 JP20120201429 申请日期 2012.09.13
申请人 株式会社日立国際電気 发明人 岡田 格;▲たか▼木 康祐;加我 友紀直
分类号 H01L21/31;C23C16/455 主分类号 H01L21/31
代理机构 代理人
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