| 摘要 |
A power electronic assembly and a method of producing a power electronic assembly. The assembly comprising a power electronic module having multiple of semiconductor power electronic switch components, the power electronic module comprising a base plate, the power electronic assembly comprising further a cooling arrangement for cooling the power electronic module. The cooling arrangement comprises a cooling surface adapted to be attached against the base plate of the power electronic module, wherein the cooling arrangement comprises further one or more heat pipes formed in the cooling surface for spreading the heat in the cooling arrangement and removing the heat from the cooling arrangement. The power electronic assembly comprises further a carbon based material layer arranged between the base pate of the power electronic module and the cooling surface of the cooling arrangement, the carbon based material layer being adapted to spread the heat generated by the semiconductor power electronic switch components and to transfer the heat from the power electronic assembly to the cooling arrangement. |
