| 摘要 |
PROBLEM TO BE SOLVED: To provide a board for mounting an LED element which has a high reflectance in the primary stage of manufacturing, and a high resistance against a corrosive gas and the like, and which allows the effective suppression of the deterioration in reflectance owing to the pile-up of copper with the copper located in a downside portion of a reflective layer, and a manufacturing method thereof, and a semiconductor device with the board for mounting an LED element.SOLUTION: A board 1 for mounting an LED element 12 comprises: a base material 2; a reflective layer 3 at least provided on a mounting area MA for mounting the LED element 12 in the base material 2, and including silver or silver alloy; and a coating layer 4 covering the reflective layer 3 so that the reflective layer 3 on the mounting area MA is partially exposed, and including a metal other than the silver or silver alloy, provided that the metal is higher in corrosion resistance than the silver or silver alloy. Crystal grains of the silver or silver alloy having a sectional area of 1 μmor larger account for no less than 70% of the total area of a predetermined cross section of the reflective layer 3 in a thickness direction thereof. |
