| 摘要 |
FIELD: furnace; food industry.SUBSTANCE: device includes at least one bottom plate (1, 2) moving through baking chamber during baking. Area of bottom plate can be heated to baking temperature. Bottom plate has a sensor device (5) for detecting temperature bottom plate (1, 2) and/or pressure acting on area (3) of bottom plate (1, 2) during baking. Sensor device (5) comprises at least one sensor (6), and is located in hole (7) for receiving sensor in bottom plate (1, 2), so that sensor (6) with sensor head (8) is located in area (3) of bottom or in close proximity to area (3) of bottom.EFFECT: invention enables to prevent contamination and wear of equipment.18 cl, 14 dwg |
